Sockel:

AM4 Sockel

Prozessor: AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors
Chipsatz: AMD B550
Speicher:
  1. 2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
  2. 3rd Gen AMD Ryzen™ Processors:
    Support for DDR4 4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules
  3. New Generation AMD Ryzen™ with Radeon™ Graphics processors:
    Support for DDR4 5300(O.C.)/5200(O.C.)/5000(O.C.)/4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules
  4. Dual channel memory architecture
  5. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules
  6. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  7. Support for Extreme Memory Profile (XMP) memory modules
Grafik: Integrated in the New Generation AMD Ryzen™ with Radeon™ Graphics processors:
  1. 1 x DisplayPort, supporting a maximum resolution of 5120x2880@60 Hz
    • Support for DisplayPort 1.4 version, HDCP 2.3, and HDR.
  2. 2 x HDMI ports, supporting a maximum resolution of 4096x2160@60 Hz
    • Support for HDMI 2.1 version, HDCP 2.3, and HDR.
Support for up to 3 displays at the same time
Maximum shared memory of 16 GB
Steckplätze:
1‎ x PCI Express x16 slot (PCIEX16), integrated in the CPU:
  1. 3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode
  2. New Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode
Storage:
  1. 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2260/2280 SSDs:
    • 3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs
    • New Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs
  2. 1 x M.2 connector (M2B_SB) on the back of the motherboard, integrated in the Chipset, supporting Socket 3, M key, type 2260/2280 SSDs:
    • Supporting SATA and PCIe 3.0 x4/x2 SSDs
  3. 4 x SATA 6Gb/s connectors, integrated in the Chipset:
    • Support for RAID 0, RAID 1, and RAID 10
Sound:
  1. Realtek® ALC1220-VB codec
    • The back panel line out jack supports DSD audio.
  2. High Definition Audio
  3. 2/4/5.1/7.1-channel
    • To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
LAN: Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
Wireless Communication: Intel® Wi-Fi 6 AX200
  1. WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band
  2. BLUETOOTH 5
  3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    • Actual data rate may vary depending on environment and equipment.
USB: CPU:
  1. 4 x USB 3.2 Gen 1 ports on the back panel
Chipset:
  1. 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
  2. 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
  3. 2 x USB 3.2 Gen 1 ports available through the internal USB header
  4. 2 x USB 2.0/1.1 ports available through the internal USB header
Interne I/O Anschlüsse:
  1. 1 x 24-pin ATX main power connector
  2. 1 x 8-pin ATX 12V power connector
  3. 1 x CPU fan header
  4. 2 x system fan headers
  5. 1 x addressable LED strip header
  6. 1 x RGB LED strip header
  7. 4 x SATA 6Gb/s connectors
  8. 2 x M.2 Socket 3 connectors
  9. 1 x front panel header
  10. 1 x front panel audio header
  11. 1 x speaker header
  12. 1 x USB 3.2 Gen 1 header
  13. 1 x USB 2.0/1.1 header
  14. 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
  15. 1 x Clear CMOS jumper
Rückseite I/O Panel:
  1. 1 x DisplayPort
  2. 2 x HDMI ports
  3. 1 x USB 3.2 Gen 2 Type-A port (red)
  4. 4 x USB 3.2 Gen 1 ports
  5. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
  6. 1 x Q-Flash Plus button
  7. 1 x RJ-45 port
  8. 2 x SMA antenna connectors (2T2R)
  9. 3 x audio jacks
Formfaktor: Mini-ITX
Abmessungen : 17.0cm x 17.0cm
unterstützte BS :   - Microsoft® Windows® 10 64-bit