Sockel:

AM4 Sockel

Prozessor: Build in AMD for 3rd Gen AMD Ryzen™ and 3rd Gen AMD Ryzen™ with Radeon™ Graphics Processors
Chipsatz: AMD B550
Speicher:

3rd Gen AMD Ryzen™ Processors
4 x DIMM, Max. 128GB, DDR4 4600(O.C)/4400(O.C)/4266(O.C.)/4133(O.C.)/4000(O.C.)/3866(O.C.)/3733(O.C.)/3600(O.C.)/3466(O.C.)/3333(O.C.)
/3200/3000/2800/2666/2400/2133 MHz Un-buffered Memory *
3rd Gen AMD Ryzen™ with Radeon™ Graphics Processors
4 x DIMM, Max. 128GB, DDR4 4800(O.C.)/4600(O.C)/4466(O.C.)/4400(O.C)/4266(O.C.)/4133(O.C.)/4000(O.C.)/3866(O.C.)/
3733(O.C.)/3600(O.C.)/3466(O.C.)/3333(O.C.)
/3200/3000/2800/2666/2400/2133 MHz Un-buffered Memory
Dual Channel Memory Architecture
ECC Memory (ECC mode) support varies by CPU.

Grafik: 1 x DisplayPort 1.2
1 x HDMI 2.1(4K@60HZ)
*Graphics specifications may vary between CPU types.
Steckplätze:

3rd Gen AMD Ryzen™ Processors
1 x PCIe 4.0 x16 (x16 mode)
3rd Gen AMD Ryzen™ with Radeon™ Graphics Processors
1 x PCIe 3.0 x16 (x16 mode)
AMD B550 Chipset
1 x PCIe 3.0 x16 (x4 mode)
1 x PCIe 3.0 x1

  • Support PCIe bifurcation for RAID on CPU function.
Storage:

Total supports 2 x M.2 slot(s) and 4 x SATA 6Gb/s ports
3rd Gen AMD Ryzen™ Processors :
1 x M.2_1 socket 3, with M Key, Type 2242/2260/2280 (PCIE 4.0 x4 and SATA modes) storage devices support
3rd Gen AMD Ryzen™ with Radeon™ Graphics Processors :
1 x M.2_1 socket 3, with M Key, Type 2242/2260/2280 (PCIE 3.0 x4 and SATA modes) storage devices support
AMD B550 Chipset :
1 x M.2_2 socket 3, with M Key, Type 2242/2260/2280/22110(PCIE 3.0 x4 and SATA modes) storage devices support
4 x SATA 6Gb/s port(s),
Support Raid 0, 1, 10

Sound: Realtek ALC S1200A 7.1 Surround Sound High Definition Audio CODEC
  • Supports : Jack-detection, Multi-streaming, Front Panel Jack-retasking, up to 24-Bit/192kHz playback

Audio Feature :

  • Exclusive DTS Custom for GAMING Headsets.
  • Optical S/PDIF out port(s) at back panel
  • Audio cover
  • Audio Shielding
  • Dedicated audio PCB layers
  • Premium Japanese audio capacitors
LAN: Realtek RTL8125B 2.5Gb Ethernet
TUF LANGuard
WLAN: Intel® Wi-Fi 6 AX200
2x2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) support 1024QAM/OFDMA/MU-MIMO
Supports up to 2.4Gbps max data rate
Supports dual band frequency 2.4/5 GHz
Supports channel bandwidth: HT20/HT40/HT80/HT160
Supports PCIe interface
USB: Rear USB Port ( Total 8 )
2 x USB 3.2 Gen 2 port(s)(1 x Type-A +1 x USB Type-C®)
4 x USB 3.2 Gen 1 port(s)(4 x Type-A)
2 x USB 2.0 port(s)(2 x Type-A)
Front USB Port ( Total 6 )
2 x USB 3.2 Gen 1 port(s)(2 x Type-A)
4 x USB 2.0 port(s)(4 x Type-A)
Interne I/O Anschlüsse: 1 x CPU Fan connector(s)
1 x CPU OPT Fan connector(s)
2 x Chassis Fan connector(s)
2 x Aura RGB Strip Headers
1 x Addressable Gen 2 header(s)
1 x USB 3.2 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.2 Gen 1 port(s)
2 x USB 2.0 connector(s) support(s) additional 4 USB 2.0 port(s)
1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (SATA mode & X4 PCIE mode)
1 x M.2 Socket 3 with M Key, type 2242/2260/2280/22110 storage devices support (SATA mode & X4 PCIE mode)
1 x SPI TPM header
4 x SATA 6Gb/s connector(s)
1 x 24-pin EATX Power connector(s)
1 x 8-pin EATX 12V Power connectors
1 x Front panel audio connector(s) (AAFP)
1 x Clear CMOS jumper(s)
1 x System panel connector
1 x COM port header
1 x Speaker connector
Rückseite I/O Panel: 1 x PS/2 keyboard/mouse combo port(s)
1 x DisplayPort
1 x HDMI
1 x LAN (2.5G) port(s)
2 x USB 3.2 Gen 2 (teal blue) (1 x Type-A+1 x USB Type-C®)
2 x USB 2.0
4 x USB 3.2 Gen 1 (blue) (one port can be switched to USB BIOS FlashBack™)
1 x Optical S/PDIF out
5 x Audio jack(s)
1 x BIOS FlashBack™ Button(s)
1 x ASUS Wi-Fi Module
Formfaktor: µATX
Abmessungen : 24.4 cm x 24.4 cm 
unterstützte BS :   - Microsoft® Windows® 10 64-bit